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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 33 tsz02201-0p4p0d301380-1-2 ? 2015 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 tsz22111 ? 14 ? 001 www.rohm.com low duty lcd segment driver for automotive cog application bu91r63 ch -m3bw max 1 76 segments (seg 44 x com4) general description BU91R63CH-M3BW is a 1/4, 1/3, 1/2 duty or static cog type lcd driver that can be used for automotive applications and can drive up to 176 lcd segments. it can support operating temperature of up to +105c and compliant for aec-q100, as required for automotive application. it has integrated display ram for reducing cpu load. also, it is designed with low power consumption and no external component needed . it includes read function for display ram and command register, wherein it is possible to detect malfunction due to noise. also a defective mounting of cog can easily be controlled by using pins to measure ito resistance. features ? aec -q100 compliant (note1) ? 1/ 4, 1/3, 1/2 duty or static setting select able 1/4 duty drive: max 1 76 segments 1/3 duty drive: max 1 32 segments 1/2 duty drive: max 88 segments static drive: max 44 segments ? integrated buffer amp for lcd driving ? support read register and display ram function ? support ito resistance measurement ? integrated oscillator circuit ? integrated evr function to adjust lcd contrast ? integrated power-on reset circuit ? no external components ? low power consumption design (note1) quality information: there is data when lsi was put on a temporary package. please use it as reference data. key specifications ? supply voltage range: +2.7v to +6.0v ? lcd drive power supply range: +2.7v to +6.0v ? operating temperature range: - 40 c to +105c ? max segments: 176 segments ? display duty: 1/ 4, 1/3, 1/2, static selectable ? bias: 1/2, 1/3 selectable ? interface: 2 wire serial interface special characteristics ? esd(hbm): 2000v ? latch-up current: 100ma applications ? instrument clusters ? climate controls ? car audios / radios ? metering ? white goods ? healthcare products ? battery operated applications etc. package au bump chip typical application circuit figure 1. typical application circuit 44 x 4 dots (top view) BU91R63CH-M3BW (bottom view) [ lcd module ] seg com 0 43 0 3 sda scl vdd vss vlcd mcu sda scl vdd vss vlcd (note) sda of BU91R63CH-M3BW needs pull- up resistor due to open-drain output. in case that scl of mcu has open-drain structure, it also needs pull-up resistor. datashee t downloaded from: http:///
2/ 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagram / pin description figure 2. block diagram table 1. pin description terminal name i/o function handling when unused t0 i por enable setting vdd: por disable (note) vss: por enable vss t1 i test input (rohm use only) must be connected to vss. vss t2 i test input (rohm use only) must be connected to vss. vss dummy - open open dummy1, 2 - can be used for cog resistance measurement. open oscin i external clock input external clock and internal clock can be selected by comman d must be connected to vss when us ing internal oscillat or vss sda i/o serial data in -out terminal - scl i serial clock terminal - vss i gnd - vdd i power supply for logic - vlcd i power supply for lcd driving circuit - seg0 to 43 o segment output for lcd driving open com0 to 3 o common output for lcd driving open (note) th is function is guaranteed by design, not tested in production process. software reset is necessary to initialize ic in case of t0=vdd. vlcd vdd t0 sda scl seg 43 com3 com2 com1 seg 0 --- lcd voltage generator com0 vss oscin t1 t2 if filter ddram lcd bias selector segment driver common driver oscillator serial interface command register command data decorder common counter blink timing generator power on reset v0 downloaded from: http:///
3/ 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pad arrangement (top view) item size unit x y chip size 650 3560 m chip thickness 230 m bump height 15 3 m bump hardness 50 20 hv dummy1 dummy1 sda sda scl scl oscin oscin vss vss t0 t0 t1 t1 t2 t2 vdd vdd vdd vdd vss vss vss vss vss vss vss vlcd vlcd vlcd vlcd dummy2 dummy2 dummy com3 com2 com1 com0 seg43 seg42 seg41 seg40 seg39 seg38 seg37 seg36 seg35 seg34 seg33 seg32 seg31 seg30 seg29 seg28 seg27 seg26 seg25 seg24 seg23 seg22 seg21 seg20 seg19 seg18 seg17 seg16 seg15 seg14 seg13 seg12 seg11 seg10 seg9 seg8 seg7 seg6 seg5 seg4 seg3 seg2 seg1 seg0 dummy alignment mark1 alignment mark2 (0, 0) 81um 81um 27um mark center coodinates (x, y) = (206.6, -1685.0) mark center coodinates (x, y) = (206.6, 1685.0) alignment mark 1 alignment mark 2 27um 27um 27um 27um 27um downloaded from: http:///
4/ 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 recommended ito layout (top view) dummy1 dummy1 sda sda scl scl oscin oscin vss vss t0 t0 t1 t1 t2 t2 vdd vdd vdd vdd vss vss vss vss vss vss vss vlcd vlcd vlcd vlcd dummy2 dummy2 dummy com3 com2 com1 com0 seg43 seg42 seg41 seg40 seg39 seg38 seg37 seg36 seg35 seg34 seg33 seg32 seg31 seg30 seg29 seg28 seg27 seg26 seg25 seg24 seg23 seg22 seg21 seg20 seg19 seg18 seg17 seg16 seg15 seg14 seg13 seg12 seg11 seg10 seg9 seg8 seg7 seg6 seg5 seg4 seg3 seg2 seg1 seg0 dummy alignment mark1 alignment mark2 (0, 0) internal wiring internal wiring lcd module terminals test pads on the glass (if need) ito layout image sda scl vdd vss vlcd (note) design ito layout to minimize its resistance. downloaded from: http:///
5/ 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pad coordinates no terminal name bump center bump size x y x y 1 dummy1 -248.00 1340.00 60 55 2 dummy1 -248.00 1270.00 60 55 3 sda -248.00 1045.00 60 55 4 sda -248.00 975.00 60 55 5 scl -248.00 905.00 60 55 6 scl -248.00 835.00 60 55 7 oscin -248.00 765.00 60 55 8 oscin -248.00 695.00 60 55 9 vss -248.00 625.00 60 55 10 vss -248.00 555.00 60 55 11 t0 -248.00 485.00 60 55 12 t0 -248.00 415.00 60 55 13 t1 -248.00 345.00 60 55 14 t1 -248.00 275.00 60 55 15 t2 -248.00 205.00 60 55 16 t2 -248.00 135.00 60 55 17 vdd -248.00 65.00 60 55 18 vdd -248.00 -5.00 60 55 19 vdd -248.00 -75.00 60 55 20 vdd -248.00 -145.00 60 55 21 vss -248.00 -215.00 60 55 22 vss -248.00 -285.00 60 55 23 vss -248.00 -355.00 60 55 24 vss -248.00 -425.00 60 55 25 vss -248.00 -495.00 60 55 26 vss -248.00 -565.00 60 55 27 vss -248.00 -635.00 60 55 28 vlcd -248.00 -705.00 60 55 29 vlcd -248.00 -775.00 60 55 30 vlcd -248.00 -845.00 60 55 31 vlcd -248.00 -915.00 60 55 32 dummy2 -248.00 -1005.00 60 55 33 dummy2 -248.00 -1636.00 60 55 34 dummy 227.00 -1496.55 75 39 35 com3 227.00 -1442.55 75 39 36 com2 227.00 -1388.55 75 39 37 com1 227.00 -1334.55 75 39 38 com0 227.00 -1280.55 75 39 39 seg43 227.00 -1226.55 75 39 40 seg42 227.00 -1172.55 75 39 41 seg41 227.00 -1118.55 75 39 42 seg40 227.00 -1064.55 75 39 43 seg39 227.00 -950.90 75 39 44 seg38 227.00 -896.90 75 39 45 seg37 227.00 -842.90 75 39 46 seg36 227.00 -788.90 75 39 47 seg35 227.00 -734.90 75 39 48 seg34 227.00 -680.90 75 39 49 seg33 227.00 -626.90 75 39 50 seg32 227.00 -572.90 75 39 51 seg31 227.00 -458.85 75 39 52 seg30 227.00 -404.85 75 39 53 seg29 227.00 -350.85 75 39 54 seg28 227.00 -296.85 75 39 55 seg27 227.00 -242.85 75 39 56 seg26 227.00 -188.85 75 39 57 seg25 227.00 -134.85 75 39 58 seg24 227.00 -80.85 75 39 59 seg23 227.00 33.20 75 39 60 seg22 227.00 87.20 75 39 61 seg21 227.00 141.20 75 39 62 seg20 227.00 195.20 75 39 63 seg19 227.00 249.20 75 39 64 seg18 227.00 303.20 75 39 65 seg17 227.00 357.20 75 39 66 seg16 227.00 411.20 75 39 67 seg15 227.00 525.25 75 39 68 seg14 227.00 579.25 75 39 69 seg13 227.00 633.25 75 39 70 seg12 227.00 687.25 75 39 71 seg11 227.00 741.25 75 39 72 seg10 227.00 795.25 75 39 73 seg9 227.00 849.25 75 39 74 seg8 227.00 903.25 75 39 75 seg7 227.00 1017.30 75 39 76 seg6 227.00 1071.30 75 39 77 seg5 227.00 1125.30 75 39 78 seg4 227.00 1179.30 75 39 79 seg3 227.00 1233.30 75 39 80 seg2 227.00 1287.30 75 39 81 seg1 227.00 1341.30 75 39 82 seg0 227.00 1395.30 75 39 83 dummy 227.00 1449.30 75 39 downloaded from: http:///
6/ 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (vss = 0 v) parameter symbol ratings unit remarks min typ max maximum voltage1 vdd - 0. 5 - +7.0 v power s upply maximum voltage2 vlcd - 0. 5 - +7.0 v lcd drive voltage input voltage range vin - 0. 5 - +7.0 v human body model (hbm) (note1), (note2) vesd - 2000 - v latch-up current (note1), (note3) ilu - 100 - ma operational temperature range topr - 40 - +105 c storage temperature range tstg - 55 - +125 c (note1) please use as reference data. (note2) testing standards: jesd22-a114e (note3) testing standards: jesd78 caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit p rotection measures, such as adding a fuse, i n case the ic is operated over the absolute maximum ratings. recommend operating conditions (ta = -40c to 10 5c, vss = 0 v) parameter symbol ratings unit remarks min typ max power supply voltage 1 vdd 2.7 - 6.0 v power s upply power supply voltage 2 vlcd 2.7 - 6.0 v lcd drive voltage electrical characteristics dc characteristics (ta = -40c to 10 5c, vdd = 2.7v to 6.0v, vss = 0 .0 v, unless otherwise specified) parameter symbol limits unit condition min typ max h level input voltage vih 0.7vdd - vdd v sda, scl, oscin l level input voltage vil vss - 0.3vdd v sda, scl, oscin h level input current iih - - 1 a sda, scl, oscin, t0, t1, t2 l level input current iil -1 - - a sda, scl, oscin, t0, t1, t2 sda l level output voltage volsda 0 - 0.4 v iload=-3ma lcd driver on resistance seg ron - 3 - k iload=10ua com ron - 3 - k standby current ivdd1 - - 5 a display off, oscillation off ivlcd1 - - 5 a operating current ivdd2 - 2.0 10 a vdd = 3.3v, vlcd = 3.3v, ta = 25 c , power save mode1, 1/3 bias, frame inversion frame frequency = 80hz setting ivlcd2 - 5 .5 20 a downloaded from: http:///
7/ 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics C continued oscillation characteristics ( ta = - 40 c to 10 5c, vdd = 2.7v to 6.0v, vss = 0 v, unless otherwise specified) parameter symbol limits unit condition min typ max frame frequency 1 fclk1 56 80 104 hz fr = 80hz setting, vdd=2.7v to 6.0v , ta=-40c to +105c frame frequency 2 fclk2 72 80 88 hz fr = 80hz setting, vdd=3.5v , ta=-40c to +105c external clock rise time trclk - - 0.3 s external clock setting (note) external clock fall time tfclk - - 0.3 s external clock frequency fclk3 30 - 3 00 khz external clock duty tdty 30 50 70 % (note) disctl 80hz setting: frame frequency [hz] = external clock [hz] / 51 2 disctl 130hz setting: frame frequency [hz] = external clock [hz] / 315 disctl 64hz setting: frame frequency [hz] = external clock [hz] / 64 8 disctl 200hz setting: frame frequency [hz] = external clock [hz] / 205 [reference data ] figure 3 . typical temperature characteristics 50 60 70 80 90 100 110 - 40 - 20 0 20 40 60 80 100 fosc[khz] temperature[ c] vdd = 6.0v vdd = 5.0v vdd = 3.3v vdd = 2.7v downloaded from: http:///
8/ 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics - continued mpu interface characteristics (ta = - 40 c to 10 5c, vdd = 2.7v to 6.0v, vss = 0v , unless otherwise specified) parameter symbol limits unit condition min typ max input rise time tr - - 0.3 s input fall time tf - - 0.3 s scl cycle time tcyc 2.5 - - s h level scl pulse width thw 0.6 - - s l level scl pulse width tlw 1.3 - - s sda setup time tsds 100 - - ns sda h old time tsdh 100 - - ns bus free time tbuf 1.3 - - s start condition hold time thd;sta 0.6 - - s start condition setup time tsu;sta 0.6 - - s stop condition setup time tsu;sto 0.6 - - s figure 4. interface timing i/o terminal equivalen ce circuit diagrams figure 5. i/o equivalen ce circuit tbuf sda scl tsdh sda thd; sta ts lw tr ts hw tf tsds tsu; sta tsu; sto tscyc v lc d vss sda vss vdd vss scl, t0, t1, t2, oscin vss v lc d seg/com vss downloaded from: http:///
9/ 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 function al descriptions command / d ata transfer method BU91R63CH-M3BW is controlled by 2-wire signal (sda, scl). figure 6 . 2 wire command/data transfer format it is necessary to generate start and stop condition when sending comman d or display data through the 2 wire serial interface. slave address s 0 1 1 1 1 1 0 m a c command display data a a p acknowledge start condition command or data judge bit stop condition r/w figure 7 . interface protcol the following procedure shows how to transfer command and displ ay data. (1) generate start condition. (2) issue slave address. (3) transfer command and display data. (4) generate stop condition acknowledge (ack) data format is comprised of 8 bits, acknowledge bit is returned aft er sending 8-bit data. after the transfer of 8-bit data (slave address, command, display dat a), release the sda line at the falling edge of the 8th clock. the sda line is then pulled low until the falling edge of the 9th clock scl. (output cannot be pulled high because of open drain nmos). if acknowledge function is not required, keep sda line at l ow level from 8th falling edge to 9th falling edge of scl. figure 8. acknowledge timing sda scl start condition stop condition sda scl s 1-7 8 9 1-7 8 9 1-7 8 9 p start condition stop condition slave address ack data ack data ack downloaded from: http:///
10 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 command transfer method issue slave address (01111100) after generat ing start condition. the 1 st byte after slave address always becomes command input. msb (command or data judge bit) of command decide to next data is comm and or display data. hen set command or data judge bit=1, next byte will be command. hen set command or data judge bit=0, next byte data is dis play data. slave address a 1 s command a 1 command a 1 command a 0 command a p display data it cannot accept input command once it enters into display data t ransfer state. in order to input command again it is necessary to generate start condition . if start condition or stop condition is sent in the middle of command transmission, command wil l be cancelled. if slave address is continuously sent following start condition , it remains in command input state. slave address must be sent right after the start condition . when slave address cannot be recognized in the first dat a transmission, no acknowledge bit is generated and next transmission will be invalid. when data is invalid statu s, if start condition is transmitted again, it will return to valid status. consider the mpu interface characteristic such as input rise time a nd setup/hold time when transferring command and data (refer to mpu interface). write display data and transfer method for write mode set r/w bit to 0 . BU91R63CH-M3BW has display data ram (ddram) of 444=176bit. the relationship between data input and display data, ddram data and a ddress are as follows. 8-bit data is stored in ddram. adset command specifies the address to be written, and address is automatically incremented in every 4-bit data. data can be continuously written in ddram by transmitting data continu ously. when ram data is written successively, after writing ram data to 2bh (seg 43 ), the address is returned to 00h (seg0) by the auto-increment function ddram address 00 h 01 h 02 h 03 h 04 h 05 h 06 h 07 h ??? 29 h 2a h 2b h bit 0 a e i m com0 1 b f j n com1 2 c g k o com2 3 d h l p com3 seg 0 seg 1 seg 2 seg 3 seg 4 seg 5 seg 6 seg 7 seg 41 seg 42 seg 43 display data is written to ddram every 4-bit data. no need to wait for ack bit to complete data transfer. 0111110 a 1 s 1101000 a a b c d e f g h a i j k l m n o p a p display data slave address command 0 r/w=0 (write mode) a 0 0000000 command downloaded from: http:///
11 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 read display and transfer method for read mode set r/w bit to 1 . the display data and command register value can be read duri ng read mode. the read mode sequence is shown below. during read mode, the display data can be read from the ddram through the sda line. the data will output synchronously to scl clock input. first set address by write mode adset command to read display data . if ddram address is not specified before ddram read, the read address will sta rt from the current ddram address. address will increment automatically by +2 addresses after 8bit da ta output. master side should output ack signal after each 8bit data output. bu91r63 ch -m 3b w is kept at read mode and address increment after receivin g ack signal from master side. if there is no ack response, BU91R63CH-M3BW will not keep above rea d operation , transmit stop condition. read mode will be stopped by sending stop condition. address will be set to 00h automatically after 2bh. (it does not inc rement to 2ch or 2dh address) shown below is an example of the display data read sequence. figure 9 . read sequence scl sda slave address (read) a d7 d6 d5 d4 d3 d2 d1 d0 a d7 d6 d5 d4 d3 d2 d1 d0 a s p 0111110 a 1 s 0000000 slave address command 0 r/w(write mode) a s 0111110 1 slave address r/w(read mode) a data a data a ... p a 1 1101000 command downloaded from: http:///
12 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 read command register and transfer method the command registers can be read during read mode. the sequence for the command register read is shown below and is similar to the display data read sequence. 0111110 a s adset slave address command 0 r/w a s 0111110 1 slave address r/w a data na p a 1 110 1100 command set icset [p2] =1 regarding address setting, refer to adset command. the following register settings can be read in this mode by s etting address to 2ch, 2dh, and 2eh. address does not increment automatically after command register va lue read. register d7 d6 d5 d4 d3 d2 d1 d0 address reg1 p7 p6 p5 p4 p3 p2 p1 p0 2ch reg2 p7 p6 p5 p4 p3 p2 p1 p0 2d h reg3 0 0 0 0 p3 p2 p1 p0 2e h reg1: p7 = duty setting p6 = duty setting p5 = 1/2bias/1/3bias setting p4 = internal/external clock setting p3 = software reset setting p2 to p0 = blink setting reg2: p7 to p6 = frame frequency setting p5 to p4 = power save mode setting p3 = frame/line inversion setting p2 = display on/off setting p1 = all pixels on setting p0 = all pixels off setting reg3: p3 = contrast setting p2 = contrast setting p1 = contrast setting p0 = contrast setting the adset and icset setting address map is shown below. write mode adset icset ram address d7 d6 d5 d[4:0] p7 p6 p5 p4 p3 p2 (note) p1 p0 0000 0000 to 0001 1111 0 0 0 0 0000 to 1 1111 1 1 1 0 1 0 0 0 0010 0000 to 0010 1011 0 0 0 0 0000 to 0 1011 1 1 1 0 1 1 0 0 read mode adset icset ram address d7 d6 d5 d[4:0] p7 p6 p5 p4 p3 p2 (note) p1 p0 0000 0000 to 0001 1111 1 0 0 0 0000 to 1 1111 1 1 1 0 1 0 0 0 0010 0000 to 0010 11 10 1 0 0 0 0000 to 0 1110 1 1 1 0 1 1 0 0 (note) please take care of icset [p2] setting. downloaded from: http:///
13 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 oscillator the clock signals for logic and analog circuit can be gene rated from internal oscillator or external clock. if internal oscillator circuit is used, oscin must be connected to vss leve l. when using external clock mode, input external clock from oscin termin al after icset command setting. figure 10 . internal clock m ode figure 11 . external clock m ode lcd driver bias circuit BU91R63CH-M3BW generates lcd driving voltage with on-chip buffer amp. and it can drive lcd at low power consumption. 1/3 or 1/2 bias can be set by modeset command. line or frame inversion can be set by disctl command. refer to the lcd driving waveform for each lcd b ias setting. blinker timing generator BU91R63CH-M3BW has blink function. blink mode is asserted by blkctl command. the blink frequency varies depending on fclk characteristics at internal clock mode. refer to oscillation characteristics for fclk. reset initialize condition initial condition after executing software reset is as follows. ? display is off. ? ddram address is initialized (ddram data is not initialized). refer to command description for initial value of registers. command / function list description list of command / function no. command function 1 set ic operation (icset) software reset, internal/external clock setting ( p2 is msb data of ddram address ) 2 display control (disctl) frame frequency, power save mode setting 3 address set (adset) dram address setting register address setting 4 mode set (modeset) display on/off, b ias , duty 5 blink control (blkctl) blink off/0.5s/1s/2s/0.3 s/ 0.2s blink setting 6 all pixels control (apctl) all pixels on /off during disp on 7 contrast setting (evrset) contrast setting oscin BU91R63CH-M3BW vss oscin BU91R63CH-M3BW vss clock downloaded from: http:///
14 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 detailed command description d7 (msb) is a command or data judgment bit. refer to command and data transfer method. c: 0: next byte is ram write data. 1: next byte is command. set ic operation (icset) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 0 1 p2 p1 p0 p2: msb data of ddram address. please refer to adset command. set software reset execution. setup p1 no operation 0 software reset execute 1 hen software reset is executed, BU91R63CH-M3BW is reset to initial condition. (refer to reset initialize condition) dont set software reset (p1) with p2, p0 at the same time. set oscillator mode setup p0 reset initialize condition internal clock 0 external clock 1 internal clock mode: oscin must be connected to vss level. external clock mode: input external clock from oscin terminal. disctl 80hz setting: frame frequency [hz] = external clock [hz] / 512 disctl 130 hz setting: frame frequency [hz] = external clock [hz] / 315 disctl 64hz setting: frame frequency [hz] = external clock [hz] / 648 disctl 200hz setting: frame frequency [hz] = external clock [hz] / 205 figure 12 . osc mode switch timing command oscin_en (internal signal) internal oscillation (internal signal) external clock (oscin) icset (oscmode) internal clock mode external clock mode downloaded from: http:///
15 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 display control (disctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 0 1 p4 p3 p2 p1 p0 set frame frequency . se tup p4 p3 reset initialize condition 80hz 0 0 130hz 0 1 64hz 1 0 200hz 1 1 set lcd drive waveform. setup p2 reset initialize condition line inversion mode 0 frame inversion mode 1 power consumption is reduced in the follow ing order: line inversion > frame inversion typically, when driving large capacitance lcd, line inversion is more susceptible to influence of crosstalk. regarding driving waveform, refer to lcd driving waveform. set power save m ode setup p1 p0 reset initialize condition power save mode 1 0 0 power save mode 2 0 1 normal m ode 1 0 high power m ode 1 1 power consumption is increased in the follow ing order: power save mode 1 < power save mode 2 < normal mode < high power m ode address set (adset) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 0 0 p4 p3 p2 p1 p0 the range of address in the write mode can be set from 000000 t o 10 1011(bin). the range of address in the read mode can be set from 000000 t o 10 1110(bin). address [5:0]: msb bit is specified in icset p2 and [4:0] are specified as adset p4 - p0. dont set out of range address, otherwise address will be set to 0 00000. msb lsb internal register address [5] address [4] address [3] address [2] address [1] address [0] command icset p2 adset p4 adset p3 adset p2 adset p1 adset p0 downloaded from: http:///
16 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 mode set (mode set) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 0 0 p3 p2 p1 p0 set display on and off setup p3 reset initialize condition display off (dispoff) 0 display on (dispon) 1 display off : regardless of ddram data, all segment and common output wi ll be stopped after 1frame of data write. display off mode will be disabled after display on comm and. display on : segment and common output will be active and start to read the display data from ddram. set bias level setup p2 reset initialize condition 1/3 bias 0 1/2 bias 1 please refer to lcd drive waveform, for example of seg and com output wa veform set duty setup p1 p0 reset initialize condition 1/ 4 duty 0 0 1/ 3 duty 0 1 1/2 duty 1 0 static 1 1 blink control (blkctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 1 0 p2 p1 p0 set blink condition. blink mode (hz) p2 p1 p0 reset initialize condition off 0 0 0 0.5 0 0 1 1 0 1 0 2 0 1 1 0.3 1 0 0 0.2 1 0 1 the blink frequency varies depending on fclk characteristics at inter nal clock mode. refer to oscillation characteristics for fclk. downloaded from: http:///
17 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 all pixels control (apctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 1 1 p2 p1 p0 all display set on, off setup p1 reset initialize condition normal 0 all pixels on 1 setup p0 reset initialize condition normal 0 all pixels off 1 all pixels on: all pixels are on regardless of ddram data. all pixels off: all pixels are off regardless of ddram data. this command is valid in display on status. the data of ddram is not changed by this command. if se t both p1 and p0 =1, all pixels off will be select ed . p2 is used for p3 of contrast setting. contrast setting (evrset) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 0 0 p2 p1 p0 BU91R63CH-M3BW has 16-step electrical volume register (evr) that can set the best v0 voltage level (maximum lcd driving voltage). electrical volume register (evr) is set to 0000 in reset initialize condition . in 0000 condition, v0 output voltage is equal to vlcd input voltage. keep contrast setting for v0 voltage more than 2.7v only. refer to the below table for v0 voltage. contrast setting (v0 voltage) p3 (note) p2 p1 p0 reset initialize condition 1.000 * v lc d 0 0 0 0 0.975 * v lc d 0 0 0 1 0.950 * v lc d 0 0 1 0 0.925 * v lc d 0 0 1 1 0.900 * v lc d 0 1 0 0 0.875 * v lc d 0 1 0 1 0.850 * v lc d 0 1 1 0 0.825 * v lc d 0 1 1 1 0.800 * v lc d 1 0 0 0 0.775 * v lc d 1 0 0 1 0.750 * v lc d 1 0 1 0 0.725 * v lc d 1 0 1 1 0. 700 * v lc d 1 1 0 0 0.675 * v lc d 1 1 0 1 0.650 * v lc d 1 1 1 0 0.625 * v lc d 1 1 1 1 (note) p3 setting uses p2 of apct l. downloaded from: http:///
18 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 lcd driving waveform (1/4duty, 1/3bias) line inversion frame in version figure 13. lcd waveform at l ine inversion figure 14. lcd waveform at frame inversion 1frame com0 com1 com2 com3 segn segn+1 segn+2 segn+3 statea (com0-segn) stateb (com1-segn) com3 com1 stateb com2 com0 statea segn segn+1 segn+2 segn+3 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 v0 -v0 v0 -v0 1frame com0 com1 com2 com3 segn segn+1 segn+2 segn+3 statea (com0-segn) stateb (com1-segn) com3 com1 stateb com2 segn+2 segn+3 com0 statea segn segn+1 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 v0 -v0 v0 -v0 downloaded from: http:///
19 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (1/4duty, 1/2bias) line inversion frame inversion figure 15. lcd waveform in l ine inversion figure 16. lcd waveform in frame inversion 1frame segn+3 com1 stateb com2 com3 segn segn+1 segn+2 segn seg n+1 seg n+2 seg n+3 com0 statea com3 com0 com1 com2 v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss stateb (com1-segn) statea (com0-segn) v0 1/2 (v0) -1/2 (v0) - v0 0 v0 1/2 (v0) -1/2 (v0) - v0 0 1frame statea segn+3 com1 stateb com2 com3 com0 com1 com2 com3 segn segn+1 segn+2 segn seg n+1 seg n+2 seg n+3 com0 v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 1/2 (v0) -1/2 (v0) - v0 0 statea (com0-segn) stateb (com1-segn) v0 1/2 (v0) -1/2 (v0) - v0 0 downloaded from: http:///
20 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (1/3duty, 1/ 3bias) line inversion frame invers ion figure 17. lcd waveform in l ine inversion figure 18. lcd waveform in frame inversion 1frame com0 com1 com2 com3 segn segn+1 segn+2 segn+3 statea (com0-segn) stateb (com1-segn) com3 same waveform as com0 com1 stateb com2 com0 statea segn segn+1 segn+2 segn+3 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 v0 -v0 v0 -v0 com0 com1 com2 com3 segn segn+1 segn+2 segn+3 statea (com0-segn) stateb (com1-segn) com3 1frame same waveform as com0 com1 stateb com2 segn segn+1 segn+2 segn+3 com0 statea vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 v0 -v0 v0 -v0 downloaded from: http:///
21 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (1/3duty, 1/ 2bias) line inversion frame invers ion figure 19. lcd waveform in l ine inversion figure 20 . lcd waveform in frame inversion 1frame segn seg n+1 seg n+2 seg n+3 com1 stateb com2 com3 com0 same waveform as com0 segn+2 segn+3 com1 com2 com3 segn segn+1 com0 statea v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss stateb (com1-segn) statea (com0-segn) v0 1/2 (v0) -1/2 (v0) - v0 0 v0 1/2 (v0) -1/2 (v0) - v0 0 same waveform as com0 seg n+3 com3 segn segn+1 segn+2 segn+3 com2 com3 com0 com1 com2 1frame com0 statea com1 stateb segn seg n+1 seg n+2 v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 1/2 (v0) -1/2 (v0) - v0 0 statea (com0-segn) stateb (com1-segn) v0 1/2 (v0) -1/2 (v0) - v0 0 downloaded from: http:///
22 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (1/2duty, 1/ 3bias) line inversion frame invers ion figure 21 . lcd waveform in l ine inversion figure 22 . lcd waveform in frame inversion 1frame com0 com1 com2 com3 segn segn+1 segn+2 segn+3 statea (com0-segn) stateb (com1-segn) same waveform as com0 com1 stateb com2, 3 com0 statea segn segn+1 segn+2 segn+3 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 v0 -v0 v0 -v0 com0 com1 com2 com3 segn segn+1 segn+2 segn+3 statea (com0-segn) stateb (com1-segn) same waveform as com0 1frame com1 stateb com2, 3 segn+1 segn+2 segn+3 com0 statea segn vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 v0 -v0 v0 -v0 downloaded from: http:///
23 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (1/2duty, 1/ 2bias) line inversion frame invers ion figure 23 . lcd waveform in l ine inversion figure 24 . lcd waveform in frame inversion 1frame same waveform as com0 segn segn+1 segn+2 segn+3 segn seg n+1 seg n+2 seg n+3 com0 statea com1 stateb com2, 3 com0 com1 com2 com3 v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss stateb (com1-segn) statea (com0-segn) v0 1/2 (v0) -1/2 (v0) - v0 0 v0 1/2 (v0) -1/2 (v0) - v0 0 segn+1 segn+2 segn+3 same waveform as com0 1frame com0 com1 com2 com3 segn com1 stateb com2, 3 seg n+1 seg n+2 seg n+3 com0 statea segn v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 vss v0 1/2 (v0) -1/2 (v0) - v0 0 statea (com0-segn) stateb (com1-segn) v0 1/2 (v0) -1/2 (v0) - v0 0 downloaded from: http:///
24 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (static ) line inversion frame inve rsion figure 25 . lcd waveform in l ine inversion figure 26 . lcd waveform in frame inversion 1frame com0 (com1 to 3) segn segn+1 segn+2 segn+3 statea stateb same waveform as com0 com1 to 3 com0 statea stateb segn segn+1 segn+2 segn+3 vss v0 v0 -v0 0 v0 -v0 0 vss v0 vss v0 vss v0 vss v0 1frame com0 (com1 to 3) segn segn+1 segn+2 segn+3 statea stateb same waveform as com0 com1 to 3 segn+2 segn+3 com0 statea stateb segn segn+1 00 v0 -v0 v0 -v0 vss v0 vss v0 vss v0 vss v0 vss v0 downloaded from: http:///
25 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 example of display data if lcd layout pattern is shown as in figure 27 and 28 and ddram data is shown as in table below, display pa ttern will be shown as in figure 29. com1 com2 com3 com0 fi gure 27 . example com l ine pattern seg1 seg2 seg3 seg4 seg5 seg6 seg7 seg8 seg9 seg10 figure 28 . example seg line pattern figure 29 . example display pattern s e g 0 s e g 1 s e g 2 s e g 3 s e g 4 s e g 5 s e g 6 s e g 7 s e g 8 s e g 9 s e g 10 s e g 11 s e g 12 s e g 13 s e g 14 s e g 15 s e g 16 s e g 17 s e g 18 s e g 19 com0 d0 0 1 0 0 0 0 1 1 0 0 1 0 0 0 0 0 0 0 0 0 com1 d1 0 0 1 0 0 0 0 1 1 0 1 0 0 0 0 0 0 0 0 0 com2 d2 0 0 1 1 1 1 0 0 1 1 1 0 0 0 0 0 0 0 0 0 com3 d3 0 0 1 0 1 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0ah 0bh 0ch 0dh 0eh 0fh 10h 11h 12h 13h downloaded from: http:///
26 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 initialize sequence follow the power-on sequence below to initialize conditio n. power on stop condition start condition issue slave address execute software reset by sending icset command. after power-on and before sending initialize sequence, ea ch register value , ddram address and ddram data are random. start sequence start sequence example1 no. input d7 d6 d5 d4 d3 d2 d1 d0 descriptions 1 power on vdd =0 3.3[v] (tr=1[ms]) vlcd=0 5.0[v] 2 wait 100us initialize 3 stop stop condition 4 start start condition 5 slave address 0 1 1 1 1 1 0 0 issue slave address 6 icset 1 1 1 0 1 0 1 0 software reset 7 blkctl 1 1 1 1 0 * 0 0 blink off 8 disctl 1 0 1 0 0 0 1 0 80hz, line inversion, normal mode 9 apctl 1 1 1 1 1 0 0 0 set msb of evrset 10 evrset 1 1 1 0 0 0 0 0 evrset v0=1.00*vlcd 11 icset 1 1 1 0 1 * 0 0 ram msb address set 12 adset 0 0 0 0 0 0 0 0 ram address set 13 display data * * * * * * * * address 00h - 01h display data * * * * * * * * address 02h - 03h display data * * * * * * * * address 2ah C 2bh 14 stop stop condition 15 start start condition 16 slave address 0 1 1 1 1 1 0 0 issue slave address 17 modeset 1 1 0 0 1 0 0 0 display on, 1/4 duty, 1/3bias 18 stop stop condition (*: don t care) downloaded from: http:///
27 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 start sequence example2 BU91R63CH-M3BW is initialized with initialize sequence , starts to display with dispon sequence, updates display data with ram write sequence and stops the display with dispoff sequence. execute dispon s equence in order to restart display. abnormal operation may occur in bu 91 r63ch-m3bw due to the effect of noise or other external factor. to avoid this phenomenon, it is highly recommended to in put command according to sequence described above durin g initialization, display on/off and refresh of ram data. initialize sequence dispon sequence ram w rite sequence dispoff sequence initialize ramwrite dispoff dispon initialize sequence (in case of vdd vlcd) d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 7c icset 1 1 1 0 1 0 1 0 execute softw are reset slave address 0 1 1 1 1 1 0 0 7c icset 1 1 1 0 1 0 1 0 execute softw are reset modeset 1 1 0 0 0 0 0 0 display off icset 1 1 1 0 1 0 0 0 set ram address adset 0 0 0 0 0 0 0 0 set ram address display data * * * * * * * * display data input data description vdd on stop w ait 100us start stop stop start vlcd on initialize sequence (in case of vdd = vlcd) d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 7c icset 1 1 1 0 1 0 1 0 execute softw are reset modeset 1 1 0 0 0 0 0 0 set display off icset 1 1 1 0 1 0 0 0 set msb of ram address adset 0 0 0 0 0 0 0 0 set ram address display data * * * * * * * * display data data description input vdd, vlcd on w ait 100us stop stop start dispoff sequence d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 7c modeset 1 1 0 0 0 0 0 0 display off data description start stop input dispon sequence d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 7c icset 1 1 1 0 1 0 0 0 set internal osc mode disctl 1 0 1 0 0 0 1 0 set display control blkctl 1 1 1 1 0 0 0 0 set blkctl apctl 1 1 1 1 1 1 0 0 set apctl evrset 1 1 1 0 0 0 0 0 set contrast setting modeset 1 1 0 0 1 0 0 0 display on input start stop data description ram write sequence d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 7c disctl 1 0 1 0 0 0 1 0 set display control blkctl 1 1 1 1 0 0 0 0 set blkctl apctl 1 1 1 1 1 1 0 0 set apctl evrset 1 1 1 0 0 0 0 0 set contrast setting modeset 1 1 0 0 1 0 0 0 display on icset 1 1 1 0 1 0 0 0 set msb of ram address adset 0 0 0 0 0 0 0 0 ram address set display data * * * * * * * * display data stop input data description start downloaded from: http:///
28 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 vdd tf tr toff vbot cautions in power on/off please keep power on/off sequence as below waveform. to prevent incorrect display, malfunction and abnormal current, vdd must be turn ed on before vlcd in power up sequence. vdd must be turned off after vlcd in power down sequence. please satisfies t1>0ns, t2>0ns figure 30. recommended power on/off sequence BU91R63CH-M3BW has p.o.r (power -on reset) circuit and software reset function. keep the following recommended power-on conditions in order to power up properly. set power up conditions to meet the recommended tr, tf, toff, and vbot specification below in order to ensure p.o.r operation. set pin t0 = vss to enable por circuit. recommended condition of tr, tf, toff, vbot (ta=25c) tr (note) tf (note) toff (note) vbot (note) 1ms to 500ms 1ms to 500ms min 20ms less than 0. 1v (note) th is function is guaranteed by design, not tested in production process. figure 31 . power on/off waveform if it is difficult to keep above conditions, execute the foll owing sequence as quickly as possible after power-on. setting t0 =vdd disables the por circuit, in such case, execute the following s equence. note that however it cannot accept command while supply is un stable or below the minimum supply range. note also that software reset is not a complete alternative to por func tion. 1. generate stop condition s to p condition sda scl vdd figure 32 . stop condition 2. generate start condition. start condition sda scl vdd figure 33 . start condition 3. issue slave address 4. execute software reset (icset) command vlcd 10% vdd min vdd min 10% vdd t1 t2 downloaded from: http:///
29 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the an alog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capaci tors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trace s, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-s ignal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thi ck as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute max imum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may fl ow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors en sure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) an d unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
30 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitabl y formed creating parasitic diodes or transistors. the ope ration of these parasitic elements can result in mutual interferen ce among circuits, operational faults, or physical dam age. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermor e, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power suppl y voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteri stics of this ic. 13. data transmission to refrain from data transmission is strongly recommended wh ile power supply is rising up or falling down to prevent from the occurrence of disturbances on transmission and reception . downloaded from: http:///
31 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 . ordering information b u 9 1 r 6 3 c h - m3 b w part number lineup package orderable part number au bump with tray moq: 16,320pcs BU91R63CH-M3BW marking diagram y x production control number BU91R63CH-M3BW downloaded from: http:///
32 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension tray information package name au bump with tray downloaded from: http:///
33 / 33 BU91R63CH-M3BW max 176 segments (seg44 x com4) tsz02201-0p4p0d301380-1-2 ? 20 15 rohm co., ltd. all rights reserved. 10 feb. 2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history version release page change 001 10 feb. 2016 - first release downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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